SUMCO Corp (ADR)

Q2 CY2024 (Apr-Jun 2024): SUMCO reported ¥99.5B (~$640M) quarterly revenue. TSMC's HPC segment hit 52% of revenue in Q2 2024, with AI accelerator demand as the primary growth driver. NVIDIA data center revenue was $26.3B in their Apr quarter. HBM3E was in volume production at SK Hynix and Samsung, with each HBM3E stack requiring multiple DRAM die and therefore more wafer area per device than standard DRAM. The AI-driven demand for 300mm wafers was now clearly material: (1) leading-edge logic wafers for AI GPUs/TPUs/ASICs at TSMC, Samsung, Intel, and (2) advanced DRAM wafers for HBM at all three memory makers. SUMCO management noted in mid-2024 earnings calls that advanced 300mm wafer demand was recovering, with particular strength in logic and DRAM for data center applications. Math: 75% from 300mm x 27% leading-edge share x 30% AI share of leading-edge = ~6.1%, rounded to 6.0%. ¥99.5B x 6.0% = ~¥6.0B (~$39M) estimated AI revenue.